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dc.contributor.authorGarcia, Sonia M.
dc.contributor.authorRamos, Joana
dc.contributor.authorArrizubieta Arrate, Jon Iñaki
dc.contributor.authorFigueras, Jordi
dc.date.accessioned2020-10-15T08:31:14Z
dc.date.available2020-10-15T08:31:14Z
dc.date.issued2020-09-19
dc.identifier.citationApplied Sciences 10(18) : (2020) // Article ID 6556es_ES
dc.identifier.issn2076-3417
dc.identifier.urihttp://hdl.handle.net/10810/46903
dc.description.abstractThe paper presents the results of an analysis based on the photodiode monitoring signals obtained during the laser cutting of aluminum and stainless steel plates. The mean level of the monitoring signal was measured and related to the process parameters and the quality achieved. The investigation was conducted in the visible and infrared spectra simultaneously for each experiment and a similar behavior at both spectra was observed, concluding the existence of a relationship between the monitoring signal, the quality of the performed cut, and the characteristics of the cutting scenario. Both visible and infrared monitoring signals were found not to vary as long as the parameter used values ensuring that the cut quality was good. Nevertheless, their mean values tended to increase as the cutting quality became worse. The measured intensity of the visible spectrum signal was associated with the vapor plume formation during the cutting process, whereas the infrared signal was related to the temperatures reached.es_ES
dc.description.sponsorshipThis research was supported by the Basque Government in the Elkartek project “Digicut: Estudio fundamental de procesos de corte y definición de las bases para su digitalización” (KK-2019/00071).es_ES
dc.language.isoenges_ES
dc.publisherMDPIes_ES
dc.rightsinfo:eu-repo/semantics/openAccesses_ES
dc.rights.urihttp://creativecommons.org/licenses/by/3.0/es/
dc.subjectlaser cuttinges_ES
dc.subjectmonitoringes_ES
dc.subjectphotodiodees_ES
dc.subjectinfrared spectrumes_ES
dc.subjectvisible spectrumes_ES
dc.titleAnalysis of Photodiode Monitoring in Laser Cuttinges_ES
dc.typeinfo:eu-repo/semantics/articlees_ES
dc.date.updated2020-09-25T13:31:00Z
dc.rights.holder2020 by the authors. Licensee MDPI, Basel, Switzerland. This article is an open access article distributed under the terms and conditions of the Creative Commons Attribution (CC BY) license (http://creativecommons.org/licenses/by/4.0/).es_ES
dc.relation.publisherversionhttps://www.mdpi.com/2076-3417/10/18/6556es_ES
dc.identifier.doi10.3390/app10186556
dc.departamentoesIngeniería mecánica
dc.departamentoeuIngeniaritza mekanikoa


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2020 by the authors. Licensee MDPI, Basel, Switzerland. This article is an open access article distributed under the terms and conditions of the Creative Commons Attribution (CC BY) license (http://creativecommons.org/licenses/by/4.0/).
Except where otherwise noted, this item's license is described as 2020 by the authors. Licensee MDPI, Basel, Switzerland. This article is an open access article distributed under the terms and conditions of the Creative Commons Attribution (CC BY) license (http://creativecommons.org/licenses/by/4.0/).