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dc.contributor.authorAranzabal Santamaria, Itxaso
dc.contributor.authorMatallana Fernandez, Asier ORCID
dc.contributor.authorOñederra Leyaristi, Oier ORCID
dc.contributor.authorMartínez de Alegría Mancisidor, Iñigo ORCID
dc.contributor.authorCabezuelo Romero, David
dc.date.accessioned2024-06-18T13:22:49Z
dc.date.available2024-06-18T13:22:49Z
dc.date.issued2016-05-10
dc.identifier.citationPCIM Europe 2016; International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management, Nuremberg, Germany : 1-9 (2016)es_ES
dc.identifier.isbn978-3-8007-4186-1
dc.identifier.urihttp://hdl.handle.net/10810/68494
dc.descriptionArticulo Congreso PCIM 2016es_ES
dc.description.abstractThe technology used in the design of the high power density Electric Vehicle (EV) power inverters packaging (power modules electrical, thermal and thermo-mechanical properties) directly affect the power inverter performance, cost, reliability, efficiency and power density. In this paper the technical trends and advances in EV power module packaging technologies will be reviewed and actual manufactured automotive power modules will be evaluated. Advantages and disadvantages of such modules will be highlighted.es_ES
dc.description.sponsorshipThis work has been carried out inside the Research and Education Unit UFI11/16 of the UPV/EHU and supported by the Department of Education, Universities and Research of the Basque Government within the fund for research groups of the Basque university system IT394-10 and by the University of the Basque Country. This work has been supported by the Ministerio de Economía y Competitividad of Spain within the project DPI2014-53685-C2-2-R and FEDER funds.es_ES
dc.language.isoenges_ES
dc.publisherVDEes_ES
dc.relationinfo:eu-repo/grantAgreement/MINECO/DPI2014-53685-C2-2-Res_ES
dc.rightsinfo:eu-repo/semantics/openAccesses_ES
dc.titleStatus and advances in Electric Vehicle’s power modules packaging technologieses_ES
dc.typeinfo:eu-repo/semantics/articlees_ES
dc.rights.holder© 2016 VDE VERLAGes_ES
dc.relation.publisherversionhttps://ieeexplore-ieee-org.ehu.idm.oclc.org/document/7499593es_ES
dc.departamentoesTecnología electrónicaes_ES
dc.departamentoeuTeknologia elektronikoaes_ES


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