Komunikazioak;;Comunicaciones: Recent submissions
Now showing items 61-64 of 320
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Analysis and Design of a Multilayer DC Bus With Low Stray Impedance and Homogenous Current Distribution
(VDE, 2018-06-05)The aim of this work is to design a DC bus for a silicon carbide power converter whose application is the automotive sector. This power converter works at high voltage and current levels with high frequencies signals, so ... -
Analysis of Interleaved Series Capacitor Tapped Buck topologies for adjustable output voltage range
(VDE, 2022-05-10)During the last decade, high step-down applications have become an emerging topic in power electronics. From delivering power to modern embedded systems, to improving efficiency in high current and low voltage appliances, ... -
Status and advances in Electric Vehicle’s power modules packaging technologies
(VDE, 2016-05-10)The technology used in the design of the high power density Electric Vehicle (EV) power inverters packaging (power modules electrical, thermal and thermo-mechanical properties) directly affect the power inverter performance, ... -
Fault Injection System for SEU Emulation in Zynq SoCs
(IEEE, 2014-11-26)This paper presents a fault injection method for SEU (Single Event Upset) emulation in FPGAs based on loading at the programmable logic a configuration file with an erroneous bit. A "Xilinx Zynq®-7000 All Programmable SoC" ...